IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings
Journal title: IEEE International Symposium for Design and Technology of Electronics Packages, SIITME - Conference Proceedings
ISSN: 2641287X
E-ISSN: 26427036
Publisher: Institute of Electrical and Electronics Engineers Inc.
Country: United States
Subject: Artificial Intelligence
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials
Control and Optimization
Instrumentation
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上一篇:IEEE International Conference on Plasma Science
下一篇:IEEE International Symposium on Industrial Electronics
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